High memory density package

Details High memory density package High memory density package

H - Electricity

05

K

H05K 1/18 (2006.01) H01L 23/36 (2006.01) H01L 23/538 (2006.01) H01L 25/065 (2006.01) H01L 25/07 (2006.01) H01L 25/18 (2006.01)

Patent

CA 2045227

HIGH MEMORY DENSITY PACKAGE Abstract Disclosed is a high density microelectronic circuit package. The circuit package includes a plurality of IC chips, as memory chips, on a circuitized flexible tape, which is, in turn, bonded to a printed circuit board. The circuitized flexible tape extends outwardly from the printed circuit board and has a plurality of IC chips mounted on I/O pads on the tape. The individual IC chips are in thermal contact with a heat sink means on the surfaces thereof opposite the circuitized flexible tape. The circuitized flexible tape and the heat sink are bonded to a printed circuit board.

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