Electronic stacked assembly

Details Electronic stacked assembly Electronic stacked assembly

H - Electricity

05

K

H05K 7/00 (2006.01) H05K 7/02 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2332708

A new physical design for electronic devices (100) comprises a multi-layer stacked assembly (104-110) of a plurality of pan-shaped conductive units that form the layers of the assembly. Each unit is preferably formed from a single sheet of metal into which electronic components, such as an antenna array (208) or a filter array (314) of a transceiver, have been stamped, cut, or etched, and which is then bent around its periphery to form a pan shape. The pans are oriented to face the same direction, are stacked one on top of another, and are fixedly attached to each other by weld, solder, or adhesive. The electrical components defined by the different units are electrically interconnected in a connectorless manner, preferably by flanges (122, 124) formed in the same sheets of metal as the units themselves and extending between the units. Adjacent units in the stack define electromagnetically isolated chambers, e.g., for the filter array. Some layers perform double duty, e.g., a layer (106) that forms a part of the chamber that houses the filter array also acts as a reflector plane for the antenna array.

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