C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 7/06 (2006.01) C25D 7/00 (2006.01) C25D 17/00 (2006.01)
Patent
CA 2647969
The invention relates to a device for electroplating at least one electrically conductive substrate or a structured or electrically conductive surface covering the whole area of a non-conductive substrate. Said device comprises at least one bath, an anode and a cathode. The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least two discs (2, 4, 10) that are rotatably mounted on a respective shaft (1, 5, 14), said discs (2, 4, 10) intermeshing. The invention also relates to a method for electroplating at least one substrate, said method being carried out in a device according to the invention. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.
L'invention concerne un dispositif de revêtement galvanique d'au moins un substrat électroconducteur ou d'une surface structurée ou entièrement électroconductrice d'un substrat isolant. Ce dispositif comprend au moins un bain, une anode et une cathode. Le bain contient un électrolyte contenant au moins un sel métallique duquel des ions métalliques se détachent et se déposent sur des surfaces électroconductrices du substrat en formant une couche métallique, tandis que la cathode est mise en contact avec la surface de substrat à revêtir et le substrat est transporté de manière à traverser le bain. La cathode comporte au moins deux disques (2, 4, 10) montés rotatifs respectivement sur un arbre (1, 5, 14), ces disques (2, 4, 10) s'engrenant. L'invention concerne également un procédé de revêtement galvanique d'au moins un substrat, ce procédé étant mis en oeuvre dans un dispositif selon l'invention. L'invention concerne enfin une utilisation du dispositif selon l'invention pour le revêtement galvanique de structures électroconductrices sur un support isolant.
Kaczun Juergen
Lochtman Rene
Pfister Juergen
Pohl Gert
Schneider Norbert
Basf Se
Robic
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