C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 17/00 (2006.01) C25D 7/00 (2006.01) C25D 7/06 (2006.01) H05K 3/24 (2006.01)
Patent
CA 2649786
The invention relates to a device for electroplating at least one electrically conductive substrate (8), or an electrically conductive structure situated on a non-conductive substrate (8). Said device comprises at least one bath, an anode and a cathode (2). The bath contains an electrolyte solution, which comprises at least one metal salt and from which metal ions are deposited on electrically conductive surfaces of the substrate, as the cathode is brought into contact with the surface of the substrate to be coated and said substrate is conveyed through the bath. The cathode comprises at least one strip (2) with at least one electrically conductive segment (12) and is guided around at least two rotating shafts (3). The invention also relates to a method for electroplating at least one substrate that is carried out in a device according to the invention. According to said method, to produce the coating, the strip lies on the substrate and circulates at a speed corresponding to the speed at which the substrate is conveyed through the bath. The invention further relates to the use of said device for electroplating electrically conductive structures situated on an electrically non-conductive support.
L'invention concerne un dispositif de revêtement galvanique d'au moins un substrat électroconducteur (8) ou d'une structure électroconductrice d'un substrat isolant (8). Ce dispositif comprend au moins un bain, une anode et une cathode (2). Le bain contient un électrolyte comportant au moins un sel métallique duquel des ions métalliques se détachent et se déposent sur la surface électroconductrice du substrat, tandis que la cathode est mise en contact avec la surface de substrat à revêtir et le substrat est transporté de manière à traverser le bain. La cathode comprend au moins une bande (2) qui est dotée d'au moins une section électroconductrice (12) et est guidée autour d'au moins deux arbres rotatifs (3). L'invention concerne également un procédé de revêtement galvanique d'au moins un substrat, ce procédé étant mis en oeuvre dans un dispositif selon l'invention. Pour réaliser le revêtement, la bande repose sur le substrat et circule à une vitesse correspondant à la vitesse à laquelle le substrat traverse le bain. L'invention concerne enfin l'utilisation du dispositif selon l'invention pour le revêtement galvanique de structures électroconductrices sur un support isolant.
Kaczun Jurgen
Lochtman Rene
Pfister Jurgen
Pohl Gert
Schneider Norbert
Basf Se
Robic
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