Emi protection and cte control of three-dimensional...

Details Emi protection and cte control of three-dimensional... Emi protection and cte control of three-dimensional...

H - Electricity

05

K

H05K 1/00 (2006.01) H05K 1/02 (2006.01) H05K 3/40 (2006.01) H05K 3/46 (2006.01) H05K 3/42 (2006.01)

Patent

CA 2253565

A circuit board is disclosed comprising a substantially non-conductive substrate (12) and first and second rigid sheets (14, 16). The first sheet (14) forms a grid pattern substantially encapsulated by the substrate (12), and a portion (20) of the first sheet extends beyond a boundary of the substrate to form a first interconnection terminal. The second sheet (16) is also substantially encapsulated by the substrate (12) and has a portion which extends beyond the boundary of the substrate (12) to form a second interconnection terminal. The second sheet (16) acts as an electromagnetic interference shield, and also has a coefficient of thermal expansion less than a coefficient of thermal expansion of the substrate (12).

La présente invention concerne une carte à circuit imprimé comprenant un substrat (12) sensiblement non conducteur et une première et une deuxième plaques rigides (14, 16). La première plaque (14) se présente sous la forme d'une grille qui est sensiblement encapsulée par le substrat (12), une partie (20) de cette première plaque s'étendant au-delà d'une limite du substrat pour former une première borne d'interconnexion. La deuxième plaque (16) est, de même, sensiblement encapsulée par le substrat (12) et comprend une partie qui s'étend au-delà d'une limite du substrat (12) pour former une deuxième borne d'interconnexion. La deuxième plaque (16) fait office de blindage contre les interférences électromagnétiques et présente un coefficient de dilatation thermique inférieur au coefficient de dilation thermique du substrat (12).

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