Encapsulated chip capacitor assemblies

Details Encapsulated chip capacitor assemblies Encapsulated chip capacitor assemblies

H - Electricity

01

G

334/20

H01G 4/08 (2006.01) H01G 9/00 (2006.01) H01G 9/08 (2006.01)

Patent

CA 1220825

- 9 - ESCAPSULATED CHIP CAPACITOR ASSEMBLIES ABSTRACT Each chip capacitor consists of a rectangular tantalum body and an axial tantalum lead wire extending from the front surface of the tantalum body encapsulated by insulating material molded around said tantalum body and covering all of the surfaces thereof except for a small region of the bottom surface wherein a materialization is provided which covers a portion of the bottom surface and adjacent rear surface of the body and forms a cathode contact. The anode terminal consists of a thin metal strip abutting the encapsulant to the tantalum lead wire. D-14600

488453

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