H - Electricity – 03 – H
Patent
H - Electricity
03
H
H03H 3/08 (2006.01) H03H 9/05 (2006.01)
Patent
CA 2320343
The invention concerns a novel type of encapsulated surface wave components and a collective method for making such components. The component comprises a wave surface device at the substrate surface; the encapsulating case includes, besides the substrate, a first layer located on the substrate and locally hollowed at least at the surface wave device active surface, a printed circuit covering the whole of the first layer and conductive via holes running through the first layer/printed circuit assembly so as to ensure the electrical connection of the surface wave device from outside.
L'invention concerne un nouveau type de composants à ondes de surface, encapsulés et un procédé collectif de fabrication de tels composants. Le composant comprend un dispositif à ondes de surface à la surface d'un substrat; le boîtier d'encapsulation comprend outre le substrat, une première couche située sur le substrat et évidée localement au moins au niveau de la surface active du dispositif à ondes de surface, un circuit imprimé recouvrant l'ensemble de la première couche et des vias conducteurs traversant l'ensemble première couche/circuit imprimé, de manière à assurer la connexion électrique du dispositif à ondes de surface depuis l'extérieur.
Bidard Agnes
Bureau Jean-Marc
Robic
Thomson-Csf
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