Enclosing a substrate with a heat-recoverable article

Details Enclosing a substrate with a heat-recoverable article Enclosing a substrate with a heat-recoverable article

F - Mech Eng,Light,Heat,Weapons

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F16L 11/00 (2006.01) B29C 61/06 (2006.01) B29C 65/68 (2006.01) C09J 7/00 (2006.01) C09J 7/02 (2006.01) F16L 58/00 (2006.01) F16L 59/00 (2006.01) H01C 7/02 (2006.01)

Patent

CA 2094492

2094492 9208073 PCTABS00013 A substrate (12, 14) is enclosed with a heat recoverable backing with a layer of a thermosetting adhesive composition (20) comprising an amorphous thermoplastic resin and a thermosetting resin positioned between the heat recoverable article (10, 26) and the substrate (12, 14). The adhesive composition can be in the form of a self-supporting sheet or tape or it can be on a surface of the heat recoverable article (10). When particulate conductive filler is added to the adhesive, a conductive polymer composition can be made. Such conductive compositions are suitable for use for static dissipation in an article of the invention, or in an electrical device, e.g. a heater or a circuit protection device.

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