Epitaxial growth on low degree off-axis silicon carbide...

C - Chemistry – Metallurgy – 30 – B

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C30B 23/06 (2006.01) C30B 29/36 (2006.01)

Patent

CA 2718757

A method of epitaxially growing a SiC layer on a single crystal SiC substrate is described. The method includes heating a single-crystal SiC substrate to a first temperature of at least 1400°C in a chamber, introducing a carrier gas, a silicon containing gas and carbon containing gas into the chamber; and epitaxially growing a layer of SiC on a surface of the SiC substrate. The SiC substrate is heated to the first temperature at a rate of at least 30° C/minute. The surface of the SiC substrate is inclined at an angle of from 1° to 3° with respect to a basal plane of the substrate material.

L'invention porte sur un procédé de croissance épitaxiale d'une couche de SiC sur un substrat de SiC monocristallin. Le procédé comprend le chauffage d'un substrat de SiC monocristallin à une première température d'au moins 1 400°C dans une chambre, l'introduction dans la chambre d'un gaz véhicule, d'un gaz contenant du silicium et d'un gaz contenant du carbone ; et la croissance épitaxiale d'une couche de SiC sur une surface du substrat de SiC. Le substrat de SiC est chauffé à la première température à raison d'au moins 30°C/minute. La surface du substrat de SiC est inclinée à un angle de 1° à 3° par rapport à un plan de base du matériau de substrat.

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