C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4016
C08L 63/00 (2006.01) C08G 59/38 (2006.01) C09D 163/00 (2006.01) H01L 23/29 (2006.01)
Patent
CA 1325299
ABSTRACT OF THE DISCLOSURE An epoxy resin based powder coating composition which comprises: (A) 100 parts by weight of a mixed epoxy resin having a softening point of 60°-75°C which consists of 50 to 70 wt% of a bisphenol A type epoxy resin having a number-average molecular weight of 900 to 1,200 and 30 to 50 wt% of a cresol novolak epoxy resin; (B) 5 to 80 parts by weight of a phenolic novolak resin; (C) 0.5 to 5 parts by weight of triphenylphosphine; (D) 60 to 200 parts by weight of an inorganic powder; and (E) 0.01 to 2 parts by weight of a microfine silica powder. The epoxy resin based powder coating composition can be coated on electrical and electronic components at 90°-100°C with retaining the high moisture resistance, storage stability and free-flowing properties.
570433
Fujimoto Yoshihisa
Imai Kunio
Motoki Yoshihiro
Ueji Kazufumi
Riches Mckenzie & Herbert Llp
Somar Corporation
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