C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/02 (2006.01) C08G 59/38 (2006.01) C08J 5/24 (2006.01) C08L 63/00 (2006.01)
Patent
CA 2057512
O.Z. 0050/42088 Abstract of the Disclosure: An epoxy resin mixture contains A. an epoxy resin of high functionality, B. a bisphenol F epoxy resin of low functionality, C. optionally an epoxy resin of low functionality and low molecular weight, D. an N-containing hardener, E. optionally an accelerant, F. optionally a rubber, and G. optionally a high temperature resistant thermoplastic.
Allspach Thomas
Altstaedt Volker
Staengle Michael
Stutz Herbert
Tesch Helmut
Basf Aktiengesellschaft
Robic
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