Etching solution containing a vanadium catalyst

C - Chemistry – Metallurgy – 23 – F

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C23F 1/34 (2006.01) C23F 1/46 (2006.01) H05K 3/06 (2006.01)

Patent

CA 2069933

An electrolytically reclaimable etching solution for etching circuit boards and mold parts of copper and copper-based alloys, with a content of copper tetrammine sulfate, ammonia, ammonium sulfate, ammonium chloride, if necessary ammonium nitrate, and also a catalyzer for raising the etching rate. According to the invention, such an etching solution excels through a content of vanadium or a vanadium compound as a catalyzer in a concentration of 1 mg to 99 mg/l of etching solution, calculated as vanadium.

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