Fabrication process for flex circuit applications

H - Electricity – 05 – K

Patent

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Details

H05K 3/00 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 3/10 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2344826

The invention provides a process for fabricating a flexible printed circuit with at least one etched or plated feature on each major surface of said flexible circuit, comprising the steps of providing an input material (1) with two major surfaces, including a dielectric substrate (10) and at least one conductive base layer (11), laminating a photoresist (16) with a cover sheet (14) onto at least one major surface of the input material (1), and printing an image (18) onto the cover sheet (14) or removing the cover sheet (14) and printing the image (18) onto the photoresist (16) directly.

L'invention concerne un procédé de fabrication d'un circuit imprimé souple présentant au moins sur chaque surface principale une caractéristique de gravure ou de galvanoplastie. Ce procédé consiste à apporter un produit auxiliaire (1) présentant deux surfaces principales, à ajouter un substrat diélectrique (10) et au moins une couche de base conductrice (11), à appliquer une photorésine (16) avec une feuille de couverte (14) sur au moins une surface principale du produit auxiliaire et à imprimer une image sur la feuille de couverture (14) ou à éliminer la feuille de couverture (14) et à imprimer directement l'image (18) sur la photorésine (16).

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