C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 18/54 (2006.01) C08L 77/00 (2006.01)
Patent
CA 2152447
Platable blends comprising filled high-temperature polyamides and a minor amount of silicone oil exhibit substantial improvement in plating adhesion when further compounded with a plating adhesion promoter, more particularly a rubbery olefinic polymer having reactive functionality.
Garrett David W.
Myers Charles L.
Amoco Corporation
Gowling Lafleur Henderson Llp
Solvay Advanced Polymers L.l.c.
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