C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 18/28 (2006.01) C08G 18/70 (2006.01) C09D 175/04 (2006.01)
Patent
CA 2563981
Film-forming compositions are disclosed that are substantially free of organic solvent. The film-forming compositions include a resinous binder and at least one water dilutable additive including the reaction product of (i) a reactant including at least one isocyanate functional group with (ii) an active hydrogen containing alkoxypolyalkylene compound. Also disclosed are multi- layer composite coatings that include such film-forming compositions and methods of applying such multi-component composite coatings to a substrate.
Des compositions de formation de films sont décrites, lesquelles sont sensiblement exemptes de solvant organique. Les compositions de formation de films comprennent un liant résineux et au moins un additif pouvant être dilué dans l~eau incluant le produit de réaction d~ (i) un réactif incluant au moins un groupe fonctionnel isocyanate avec (ii) un composé alkoxypolyalkylène contenant de l~hydrogène actif. Sont également décrits des revêtements composites multicouches qui comprennent ces compositions de formation de films et des procédés d~application de ces revêtements composites multicomposants sur un substrat.
Anderson Lawrence G.
Grolemund Mary Beth
Hockswender Thomas R.
Kania Charles M.
Martin Roxalana L.
Borden Ladner Gervais Llp
Ppg Industries Ohio Inc.
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