Flexible laminate for flexible circuit

Details Flexible laminate for flexible circuit Flexible laminate for flexible circuit

B - Operations, Transporting

32

B

B32B 27/00 (2006.01) H01B 5/14 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2332789

Method of forming a flexible circuit laminate (70) for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper (24) on a first side of a generally continuous strip of polyimide (22) having a layer of metal (23) on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a performed adhesive film (44) on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.

L'invention concerne un procédé de fabrication d'un stratifié (70) pour circuit souple à utiliser dans la production de circuits souples, consistant à déposer par galvanoplastie une couche continue de cuivre (24) sur un premier côté d'une bande de polyimide (22) généralement continue comportant une couche de métal (23) sur le premier côté, à modifier un deuxième côté de la bande de polyimide pour augmenter l'énergie de surface de celle-ci, à appliquer un film adhésif préformé (44) sur le second côté de la bande de polyimide généralement continue, la bande adhésive étant constituée d'un matériau polymère sensiblement non traité, et à traiter le film adhésif de sorte qu'au moins la couche la plus à l'extérieure du film adhésif soit seulement partiellement traitée.

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