Flexible leads for tape ball grid array circuit

Details Flexible leads for tape ball grid array circuit Flexible leads for tape ball grid array circuit

H - Electricity

01

L

H01L 23/498 (2006.01) H05K 3/36 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01) H05K 3/32 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2221750

A flexible circuit construction includes a polymeric sheet, via holes in the sheet and metal circuitry disposed on the sheet. The circuitry terminates at a cantilever end partially spanning the via hole to which a solder ball is subsequently attached. The cantilever end allows the solder ball to move relative to the flexible circuit and thus compensate for misalignment and differential thermal expansion effects.

L'invention concerne une configuration de circuit souple comprenant une feuille polymère, des trous d'interconnexion dans ladite feuille et des circuits métalliques disposés sur cette même feuille. Les circuits prennent fin à une extrémité en porte-à-faux couvrant partiellement le trou d'interconnexion, à laquelle une boule de soudure est ajoutée par la suite. Cette extrémité en porte-à-faux permet à la boule de soudure d'être mobile par rapport au circuit souple et de compenser ainsi les effets d'un défaut d'alignement et de la dilatation thermique différentielle.

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