4. H - Electricity
  5. 01
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Randolph D. Schueller

H - Electricity – 01 – L

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Inventor

Country: United States Of America

Chip scale ball grid array for integrated circuit package

H - Electricity – 01 – L
Patent

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Flexible leads for tape ball grid array circuit

H - Electricity – 01 – L
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Ground plane routing

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Method of manufacturing a patterned array of solder bumps

H - Electricity – 01 – L
Patent

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Tab tape ball grid array package with vias laterally offset...

H - Electricity – 01 – L
Patent

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Tape ball grid array with interconnected ground plane

H - Electricity – 01 – L
Patent

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Profile ID: LFCA-PAI-P-1262033

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