Ground plane routing

Details Ground plane routing Ground plane routing

H - Electricity

05

K

H05K 1/00 (2006.01) H05K 1/11 (2006.01) H05K 3/36 (2006.01) H05K 1/02 (2006.01) H05K 3/28 (2006.01)

Patent

CA 2221756

A flexible circuit construction allows solder balls (26) to be mass reflow attached to the ground plane (22) of a double-sided flexible circuit (20) by providing a first via (30) which is separate from the remainder of the ground plane (22), but which is electrically connected to the ground plane (22) through a second via (38) at a distance from the first via (30) by a circuit trace (36) on the side of the flexible circuit (20) opposite the ground plane (22).

L'invention concerne la construction d'un circuit souple permettant à des globules de soudure (26) d'être fixés en masse par refusion au plan de masse (22) d'un circuit souple double-face (20) grâce à une première traversée (30) qui est séparée du reste du plan de masse (22), mais qui est connectée électriquement au plan de masse (22) par une deuxième traversée (38) située à une certaine distance de la première (30) par un ruban (36) situé sur le côté du circuit souple (20) en face du plan de masse (22).

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