Tape ball grid array with interconnected ground plane

Details Tape ball grid array with interconnected ground plane Tape ball grid array with interconnected ground plane

H - Electricity

01

L

H01L 23/498 (2006.01) H01L 23/495 (2006.01) H05K 1/11 (2006.01) H05K 3/40 (2006.01) H05K 1/00 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2344663

A flexible circuit system includes a flexible dielectric layer having a first conductive layer on a first side and a second conductive layer on a second side. A non-conductive, closed end passage extends through the dielectric layer from the first side to the second side. The first conductive layer is adjacent an open end of the passage at the first side, and the second conductive layer forms the closed end of the passage at the second side. A stiffener member is attached to the second conductive layer. A solder ball is connected to provide a conductive path between the first conductive layer and the second conductive layer.

L'invention concerne un boîtier TBGA comprenant une couche diélectrique souple dont une première couche conductrice est appliquée sur un premier côté et une seconde couche conductrice est appliquée sur un second côté. Un passage non conducteur à extrémité fermée s'étend à travers la couche diélectrique depuis le premier côté vers le second côté. La première couche conductrice est adjacente à une extrémité ouverte du passage au niveau du premier côté et la seconde couche conductrice définit l'extrémité fermée du passage au niveau du second côté. Un élément raidisseur est fixé à la seconde couche conductrice. Un globule de soudure est connecté pour déterminer un passage conducteur entre la première couche conductrice et la seconde couche conductrice.

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