Method of manufacturing a patterned array of solder bumps

H - Electricity – 01 – L

Patent

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Details

H01L 21/60 (2006.01) H01L 21/48 (2006.01) H05K 3/34 (2006.01) H05K 3/04 (2006.01)

Patent

CA 2288912

The present invention relates to a method for making an array of metal balls. The method includes the step of generating a first pattern on a metal foil which includes a plurality of foil projections. The method also includes the step of generating a second pattern on a carrier substrate. The second pattern includes a pluraltiy of carrier recesses that are arranged and configured to correspond with the foil projections of the first pattern. The method further includes the steps of placing the metal foil and the carrier substrate together such that the foil projections of the metal foil fit within the carrier recesses of the carrier substrate, and melting the metal foil such that the foil projections form metal balls positioned within the carrier recesses of the carrier substrate. The invention also relates to metal ball arrays constructed via the above method.

L'invention concerne un procédé servant à fabriquer un ensemble de globules de soudure. Ce procédé consiste à générer une première configuration sur une feuille métallique comportant une pluralité de saillies constituées par le métal de la feuille. Ce procédé consiste également à générer une deuxième configuration sur un substrat. Cette deuxième configuration comprend une pluralité d'évidements conçus pour correspondre aux saillies de la première configuration sur la feuille métallique. Il consiste, de plus, à rapprocher la feuille métallique et le substrat, de sorte que les saillies de la feuille métallique s'adaptent aux évidements du substrat, et à fondre la feuille métallique, ce qui permet d'obtenir des globules en métal à partir des saillies placées à l'intérieur des évidements du substrat. L'invention concerne également des ensembles de globules de métal fabriqués au moyen de ce procédé.

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