G - Physics – 03 – F
Patent
G - Physics
03
F
G03F 7/26 (2006.01) B01D 71/02 (2006.01) C25D 5/12 (2006.01) G03F 7/00 (2006.01) G03F 7/09 (2006.01) G03F 7/40 (2006.01)
Patent
CA 2088605
Complex metal structures are formed in microminiature dimensions utilizing multiple mask exposures which are capable of producing substantially arbitrary three-dimensional shapes. A first layer of a primary metal is electroplated onto an exposed plating base to fill a void in a photoresist, the photoresist is removed, and a secondary metal, which can constitute a sacrificial metal, is electroplated over the first layer and the plating base. The exposed surface of the deposited secondary metal is then machined down to a height which exposes the first metal to produce a substantially flat, uniform surface extending across both the primary and secondary metals. The secondary metal facilitates machining of the primary and secondary metals because of these mechanical stability provided by the secondary metal to the primary metal. After the first layers of the primary and secondary metals have been machined, another photoresist layer can be applied over the primary and secondary metals, and a second layer of primary metal is electroplated. A further layer of secondary metal can be also electroplated if desired. The process of machining and electroplating can be repeated until the desired structure is formed. Secondary metal is removed by an etchant which does not etch the primary metal.
Borden Ladner Gervais Llp
Guckel Henry
Wisconsin Alumni Research Foundation
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