Glass-ceramics for electronic packaging

Details Glass-ceramics for electronic packaging Glass-ceramics for electronic packaging

C - Chemistry, Metallurgy

03

C

261/20

C03C 10/08 (2006.01) C03C 10/00 (2006.01) H01L 23/14 (2006.01) H01L 23/15 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1300648

Abstract of the Disclosure This invention relates to the production of glass-ceramic materials particularly suitable for use as substrates in integrated circuit packaging. The inventive glass-ceramics can be prepared from thermally crystallizable glass capable of being concurrently sintered and crystallized in situ at temperatures between about 850°-1000°C to bodies exhibiting dielectric constants less than about 6, linear coeffi- cients of thermal expansion between about 12-60X10-7/°C and containing cordierite solid solution as essentially the sole crystal phase. The glass-ceramics are essen- tially free from Li2O and Na2O and consist essentially, expressed in terms of weight percent on the oxide basis of 10-25% MgO + ZnO consisting of 2-18% MgO + 0-21% ZnO, 20-38% Al2O3, 40-52% SiO2, and 2-15% total of at least one oxide in the indicated proportion selected from the group consisting of up to 8% of an alkali metal oxide selected from the group consisting of K2O, Rb2O, and Cs2O, up to 10% of a divalent metal oxide selected from the group consisting of CaO, SrO, BaO, and PbO, and ZnO, and up to 5% B2O3.

562044

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