C - Chemistry – Metallurgy – 03 – C
Patent
C - Chemistry, Metallurgy
03
C
C03C 15/00 (2006.01) H01L 21/311 (2006.01)
Patent
CA 2104087
ABSTRACT OF THE DISCLOSURE The present invention provides an improved glass etching composition which does not contain any causative materials such as hydrofluoric acid, causing environmental pollution. The etching composition comprises a first solution of a flow modifier and ammonium bifluoride in purified glycerine; and a second solution of ammonium bifluoride and ferric chloride in purified glycerine.
Gimm Soon H.
Kim Jung H.
Gimm Soon H.
Kim Jung H.
Marks & Clerk
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