C - Chemistry – Metallurgy – 03 – C
Patent
C - Chemistry, Metallurgy
03
C
C03C 21/00 (2006.01) B23K 26/073 (2006.01) B23K 26/38 (2006.01) C03B 33/08 (2006.01) C03C 23/00 (2006.01)
Patent
CA 2419683
A limited portion of a surface of a glass substrate is removed by application of a laser beam an the limited portion of the glass substrate to thereby produce a glass structure according to the invention. The glass substrate contains at least one element such as titanium, iron, vanadium, bismuth, lead, thallium, tin, cerium, rhodium or cobalt capable of absorbing energy of the laser beam and has a threshold of not larger than 1.0 J/cm2 per laser beam pulse in terms of machining energy of the laser beam. When such a glass substrate 21 is used, a glass structure having a through-hole 61 or cavity optional in sectional shape can be formed by irradiation with the laser beam 10.
Koyo Hirotaka
Tsunetomo Keiji
Nippon Sheet Glass Co. Ltd.
Riches Mckenzie & Herbert Llp
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