Glass substrates with pre-attached sealing media

C - Chemistry – Metallurgy – 03 – C

Patent

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49/78.1

C03C 27/04 (2006.01) C03C 3/072 (2006.01) C03C 3/074 (2006.01) C03C 10/00 (2006.01) C03C 27/06 (2006.01) H01J 9/26 (2006.01) H01J 17/49 (2006.01)

Patent

CA 1066059

ABSTRACT OF THE DISCLOSURE A method is disclosed for producing a glass substrate having electrical conductors deposited thereon which is suitable for gas panel fabrication. A vitreous or crystalline solder glass having a softening point between 400°F and 811°F is drawn into at least one rod from 3-40 mils in diameter. The rod is applied to one surface of the substrate adjacent the periphery thereof and the substrate prefired for a period of time in that a temperature sufficient to permanetly attach the solder glass thereto in a high sintered or glassy state which will reflow and seal at a predetermined sealing temperature.

241007

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