H - Electricity – 01 – S
Patent
H - Electricity
01
S
H01S 5/022 (2006.01) H01S 5/024 (2006.01) H02G 3/08 (2006.01) H05K 5/06 (2006.01) H05K 7/20 (2006.01)
Patent
CA 2476195
A header assembly (700) including a base (702) and a platform (800) extending through the base (702) and substantially perpendicular thereto. The platform (800) includes conductive pathways (806) that connect electrical components on either side of the base (702), and the conductive pathways cooperate to form a connector (900) at the first end of the platform (800). A laser (1002) is mounted on top of a thermoelectric cooler (900) that is directly joined to the second end of the platform (800).The laser (1002) and thermoelectric cooler (900) are enclosed in a hermetic chamber cooperatively defined by the base (702), the platform (800), and a cap that is joined to the base (702). A photodiode (1004) optically coupled with the laser (1002) and a thermistor thermally coupled with the laser (1002) cooperate with the thermoelectric cooler (900) and a control circuit to facilitate control of the performance of the laser (1002).
L'invention concerne un dispositif d'embase (700) comprenant une base (702) et une plate-forme (800) s'~tendant ~ travers la base (702) et sensiblement perpendiculaire ~ celle-ci. La plate-forme (800) comprend des passages conducteurs (806) connectant des composants ~lectriques sur un cÙt~ de la base (702), les passages conducteurs coop~rant pour former un connecteur (900) ~ la premire extr~mit~ de la plate-forme (800). Un laser (1002) est mont~ ~ la partie sup~rieure d'un refroidisseur thermo~lectrique (900) qui est directement reli~ ~ la seconde extr~mit~ de la plate-forme (800). Le laser (1002) et le refroidisseur thermo~lectrique (900) sont plac~s ~ l'int~rieur d'une chambre herm~tique d~limit~e par la base (702), la plate-forme (800) et une coiffe qui est reli~e ~ la base (702). Une photodiode (1004) est coupl~e optiquement au laser (1002), et un thermistor, coupl~ thermiquement au laser (1002), coopre avec le refroidisseur thermo~lectrique (900) et un circuit de commande facilitant le contrÙle du rendement du laser (1002).
Giaretta Giorgio
Hofmeister Rudolf J.
Rosenberg Paul K.
Schiaffino Stefano
Stewart James
Bennett Jones Llp
Finisar Corporation
LandOfFree
Header assembly having integrated cooling device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Header assembly having integrated cooling device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Header assembly having integrated cooling device will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1372031