Heat-curable bismaleimide molding materials

Details Heat-curable bismaleimide molding materials Heat-curable bismaleimide molding materials

C - Chemistry, Metallurgy

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C08F 222/40 (2006.01) B32B 27/04 (2006.01) C07D 213/69 (2006.01) C07D 237/16 (2006.01) C08G 73/12 (2006.01) H01B 1/24 (2006.01)

Patent

CA 1335856

Heat-curable bismaleimide resins contain a bismaleimide and a heterocyclic comono- mer having terminal alkenyl or alkenyloxy groups. A pre- ferred comonomer is 2,6-bis-(2-propenylphenoxy)-pyridine. The bismaleimide resins are suitable for the production of high performance composites.

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