Heat-curable polymers which contain imide groups and process

Details Heat-curable polymers which contain imide groups and process Heat-curable polymers which contain imide groups and process

C - Chemistry, Metallurgy

08

L

402/219

C08L 79/08 (2006.01) C08G 73/10 (2006.01) C08J 3/24 (2006.01)

Patent

CA 1270592

HEAT-CURABLE POLYMERS WHICH CONTAIN IMIDE GROUPS AND PROCESS ABSTRACT Heat curable compositions comprise (a) a bismaleimide, e.g., bismaleimidodiphenylmethane, and (b) a heat activat- able curing agent therefor comprising in combination (i) a polyamine and (ii) an alkenylphenol or alkenylphenol ether. After reaction, preferably at temperatures of 100° to 250°C., optionally in admixture with polymerization cata- lysts, shaped articles, laminates, adhesive bonds and foams are produced. These have superior mechanical properties, especially hot/wet properties and improved resistance to thermal aging.

500395

Affiliated with

Also associated with

Rating

Heat-curable polymers which contain imide groups and process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heat-curable polymers which contain imide groups and process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heat-curable polymers which contain imide groups and process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1178990