Hermetic polymeric topsealant coating for electronic circuitry

Details Hermetic polymeric topsealant coating for electronic circuitry Hermetic polymeric topsealant coating for electronic circuitry

B - Operations, Transporting

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B05D 3/02 (2006.01) C09D 4/00 (2006.01) H01L 21/56 (2006.01) H01L 23/29 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1085984

HERMETIC POLYMERIC TOPSEALANT COATING FOR ELECTRONIC CIRCUITRY Abstract of the Disclosure A hermetic topsealant for metal electrodes on components and other microelectronic circuitry is formed by polymerizing a mixture of an unsaturated silane monomer, a bifunctional silane adhesion promoter, a polymeric plasticizer and a stabilizer.

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