4. C - Chemistry, Metallurgy
  5. 08
  6. G

Irving Memis

C - Chemistry – Metallurgy – 08 – G

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Country: United States Of America

Hermetic polymeric topsealant coating for electronic circuitry

B - Operations – Transporting – 05 – D
Patent

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Sealing of integrated circuit modules

C - Chemistry – Metallurgy – 08 – G
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Profile ID: LFCA-PAI-P-41963

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