Sealing of integrated circuit modules

Details Sealing of integrated circuit modules Sealing of integrated circuit modules

C - Chemistry, Metallurgy

08

G

402/192, 356/21,

C08G 59/58 (2006.01) C08L 63/00 (2006.01) H01L 23/02 (2006.01) H01L 23/055 (2006.01) H01L 23/10 (2006.01)

Patent

CA 1134096

Abstract The hermetic seal of the backside of a substrate of an integrated circuit module is provided by a composition containing about 51.4 to about 60.6% by weight of an epoxy polymer; about 39 to about 48% by weight of a hardener and flexibilizing portion; and up to about 0.6% by weight of a coloring agent.

341841

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