High modulus toughened polyamide composition

Details High modulus toughened polyamide composition High modulus toughened polyamide composition

C - Chemistry, Metallurgy

08

L

C08L 77/00 (2006.01) C08L 51/00 (2006.01) C08L 51/06 (2006.01)

Patent

CA 2110402

A thermoplastic composition is provided which comprises a polyamide, a grafted polymer of an isomonoolefin and an al- kylstyrene, such as a maleic anhydride-grafted copolymer of isobutylene and paramethylstyrene, and optionally a polyolefin po- lymer.

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