Improved convection/infrared solder reflow apparatus

Details Improved convection/infrared solder reflow apparatus Improved convection/infrared solder reflow apparatus

H - Electricity

05

K

H05K 3/34 (2006.01) B23K 1/008 (2006.01)

Patent

CA 2144646

An apparatus (10) for soldering a circuit board conveyed therethrough utilizes a combination of forced convection and in- frared radiation. Fans (36, 37) are disposed in each heating zone which force gas through a heating plate (50, 51) which heats the air, emits infrared radiation for heating of the circuit boards, and establishes a gas flow pattern. Flows in each zone are controlled by means of closures (115, 116, 117, 118, 120, 122, 124, 126) which selectively introduce unheated gas and exhaust heated gas from each zone. Gas flow between zones may also be controlled.

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