Inhibited composition and method for stripping tin, lead or...

Details Inhibited composition and method for stripping tin, lead or... Inhibited composition and method for stripping tin, lead or...

C - Chemistry, Metallurgy

23

F

356/12, 149/26

C23F 1/30 (2006.01) B44C 1/22 (2006.01) C23F 1/44 (2006.01) H05K 3/06 (2006.01)

Patent

CA 2004796

ABSTRACT OF THE DISCLOSURE A composition for stripping tin, lead or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, an inorganic nitrate, preferably ferric nitrate, and an inhibitor component. The composit- ion effects rapid stripping without any appreciable for- mation of sludge or precipitate or suspended particles, and without any substantial attack on the underlying copper surface.

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