Integrated circuit having a pre-attached conductive mounting...

Details Integrated circuit having a pre-attached conductive mounting... Integrated circuit having a pre-attached conductive mounting...

H - Electricity

01

L

356/143, 356/191

H01L 21/58 (2006.01) H01L 21/60 (2006.01) H01L 23/12 (2006.01) H01L 23/14 (2006.01) H01L 23/482 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1222067

ABSTRACT A semiconductor wafer having a plurality of integrated circuits is provided. One surface of the wafer includes a plurality of electrical contacts on the circuits which are subsequently attached to leads. The other surface of the wafer is provided with a conductive tape. The wafer is cut, e.g., sawed, resulting in each individual circuit having a pre-attached conductive mounting media. The individual circuits can then be attached to a substrate through the conductive mounting media. Other embodiments are disclosed.

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