H - Electricity – 01 – L
Inventor
H - Electricity
01
L
Inventor
Country: United States Of America
Device enclosure for high density tape bonding
Integrated circuit having a pre-attached conductive mounting...
Integrated circuit lead frame with improved power dissipation
Packaged semiconductor device which provides for enhanced...
Semiconductor chip package with semiconducting lead...
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Profile ID: LFCA-PAI-P-1176575