Packaged semiconductor device which provides for enhanced...

Details Packaged semiconductor device which provides for enhanced... Packaged semiconductor device which provides for enhanced...

H - Electricity

05

K

356/167

H05K 7/20 (2006.01) H01L 23/31 (2006.01) H01L 23/373 (2006.01) H01L 23/433 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1179070

ABSTRACT A packaged semiconductor device which provides for enhanced power dissipation is disclosed. The packaged semiconductor device includes a mounting pad which is formed from a material having a thermal conductivity which is within about 20% that of copper and a coefficient of thermal expansion which is within about 20% that of silicon. A semiconductor device is mounted on the mounting pad. A plurality of metal leads having short lead fingers extend into close proximity to the mounting pad. The leads are electrically connected to the semiconductor device. An encapsulation encloses the mounting pad and the semiconductor device and extends laterally beyond the lead fingers such that the ends of the leads extend from the encapsulation as connectors for the packaged semiconductor device.

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