Integrated circuit lead frame with improved power dissipation

Details Integrated circuit lead frame with improved power dissipation Integrated circuit lead frame with improved power dissipation

H - Electricity

01

L

356/143

H01L 23/48 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1200619

INTEGRATED CIRCUIT LEAD FRAME WITH IMPROVED POWER DISSIPATION Abstract of the Disclosure A lead frame apparatus for providing electrical connections to an integrated circuit includes a paddle 10 to which the integrated circuit is attached, a series of elec- trically conductive leads 12 extending outward from opposite sides of the paddle 10, and flared regions 18 of generally expanding width extending outward from opposite sides of the paddle 10. In the preferred embodiment the flared region 18 and the electrically conductive leads 12 are maintained in alignment by tie and dam bars 15 and 17 which are removed after the lead frame 5 is encapsulated.

421605

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