B - Operations – Transporting – 41 – J
Patent
B - Operations, Transporting
41
J
356/7, 101/96.02
B41J 2/01 (2006.01) B41J 2/16 (2006.01) H01L 49/02 (2006.01) H01S 5/223 (2006.01) H01S 5/227 (2006.01) H01S 5/323 (2006.01) H01S 5/34 (2006.01)
Patent
CA 1302160
Abstract We describe an integrated thermal ink jet printhead and manufacturing process therefor which includes the successive build-up of an orifice plate, a first barrier layer, heater resistors, a second barrier layer, and an ink reservoir-defining layer on top of a reusable or "dummy" substrate. Lead-in conductors are formed integral with the heater resistors by controlling the cross- sectional areas of these components, and openings (passageways) are formed between ink reservoirs and the orifice plate to provide for ink flow under control of the heater resistors. The dummy substrate is stripped away from the adjacent orifice plate, and the ink reservoir defining layer may be secured to an ink supply tank which supplies ink to the individual ink reservoirs. Thus, the orifice plate, heater resistors and ink flow paths of the printhead are self aligned, and the heater resistors are removed from direct cavitational forces from ink ejected from the orifice plate.
572700
Bhaskar Eldurkar V.
Leban Marzio
Hewlett-Packard Company
Sim & Mcburney
LandOfFree
Integrated thermal ink jet printhead and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated thermal ink jet printhead and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated thermal ink jet printhead and method of manufacture will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1173487