H - Electricity
01
R
H01R 13/00 (2006.01) H04Q 1/14 (2006.01) H01R 13/639 (2006.01) H04M 19/00 (2006.01) H01R 12/14 (2006.01) H01R 24/04 (2006.01)
Patent
CA 2351228
The invention relates to a jack assembly including a jack mount with a jack receiving region. A jack is adapted to be slidably mounted in the jack receiving region. The jack includes a jack body formed of a dielectric material and a plurality of electrically conductive tip and ring springs. The jack body defines a plurality of bores sized to receive plugs having tip and ring contacts. The jack assembly further includes a plurality of cross-connect contacts and a rear interface assembly including a dielectric support. A plurality of rear connectors project outward from the dielectric support, and a circuit board is positioned between the jack mount and the dielectric support. The circuit board provides connections between the cross-connect contacts and the normal contacts. An electrical interface between the jack and the circuit board is configured such that when the jack is removed from the jack mount, the jack is automatically disconnected from the circuit board.
L'invention porte sur un jack d'interconnexion comportant un boîtier, une zone d'enfichage ou s'engage une fiche par glissement, un corps d'un matériau diélectrique et une série de ressorts de connexion avec les embouts et anneaux d'une fiche. Le corps du jack présente plusieurs prises destinées à recevoir des fiches munies d'embouts et d'anneaux de contact. Le jack comporte en outre plusieurs contacts d'interconnexion et une interface arrière montée sur un support diélectrique. Plusieurs connecteurs arrière saillent du support diélectrique et un circuit imprimé est placée entre le boîtier du jack et le support diélectrique. Le circuit imprimé assure des connexions entre les contacts d'interconnexion et les contacts normaux. Une interface électrique placée entre le jack et le circuit imprimé déconnecte automatiquement le jack du circuit imprimé lorsque le jack est extrait de son boîtier.
Dewey James D.
Henneberger Roy Lee
Sajadi Ahmad
Adc Telecommunications Inc.
Robic
LandOfFree
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