Laminated semiconductor sensor with vibrating element and...

H - Electricity – 04 – R

Patent

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349/63

H04R 21/00 (2006.01) G01L 9/00 (2006.01)

Patent

CA 2017704

LAMINATED SEMICONDUCTOR SENSOR WITH VIBRATING ELEMENT AND ASSOCIATED METHOD AND PRODUCT ABSTRACT OF THE DISCLOSURE An electromechanical sensor is provided which comprises: a first silicon wafer which defines a resonant element; wherein the resonant element is doped with approximately the same impurity concentration as a background dopant concentration of the first wafer; and a second single crystal wafer which defines a device for coupling mechanical stress from the second wafer to the resonant element; wherein the first and second wafers are fusion bonded together.

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