H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/00 (2006.01) H01L 23/50 (2006.01) H05K 3/20 (2006.01) H05K 3/40 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2622581
The invention relates to a laminated substrate producing method for mounting semiconductor chips, wherein at least respective metal and plastic structure films having respective different recurrent contour are laminated together in such a way that a material strip is obtained and said lamination is followed by perforations or cuttings, the inventive method is characterised by at least one of the following steps: A) the films are structured in such a way that the superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total thickness thereof; B) the films are not laminated through the total thickness of the laminate in partly recurrent areas; and C) the reccurent cross-sections of the reccurent contours are curved from the surface of the laminated strip starting from said laminate.
La présente invention concerne un procédé pour réaliser un substrat laminé destiné au montage de puces à semi-conducteur, au moins respectivement un film de métal structuré et un film de matière plastique structuré ayant des contours récurrents respectivement différents, étant laminés ensemble pour donner une bande de matière, et le laminage étant suivi de la production de trous ou d'entailles. Le procédé de l'invention se caractérise par au moins l'une des phases suivantes: A) les films sont structurés de sorte que leur superposition conduit à l'obtention de zones sur toute la largeur desquelles ne se produit aucun recouvrement; B) les films, dans des zones partielles récurrentes, ne sont pas laminés sur toute la largeur du laminé; C) à partir de ce laminé, des sections récurrentes des contours récurrents, sont incurvées depuis la surface de la bande de laminé.
Ditzel Eckhard
Gresch Manfred
Walter Siegfried
Macrae & Co.
W.c. Heraeus Gmbh
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