Large area, uniformly low dislocation density gan substrate...

C - Chemistry – Metallurgy – 30 – B

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C30B 23/00 (2006.01) B32B 9/00 (2006.01) C23C 14/00 (2006.01) C30B 25/02 (2006.01) C30B 29/40 (2006.01)

Patent

CA 2544878

Large area, uniformly low dislocation density single crystal III-V nitride material, e.g., gallium nitride having a large area of greater than 15 cm, a thickness of at least 1 mm, an average dislocation density not exceeding 5E5 cm-2, and a dislocation density standard deviation ratio of less than 25%. Such material can be formed on a substrate by a process including (i) a first phase of growing the III-V nitride material on the substrate under pitted growth conditions, e.g., forming pits over at least 50% of the growth surface of the III-V nitride material, wherein the pit density on the growth surface is at least 102 pits/cm2 of the growth surface, and (ii) a second phase of growing the III-V nitride material under pit-filling conditions.

L'invention concerne un matériau en nitrure III-V à cristal unique de faible densité de dislocation uniforme sur une grande surface, par exemple du nitrure de gallium présentant une grande surface supérieure à 15 cm?2¿, une épaisseur d'au moins 1 mm, une densité de dislocation moyenne n'excédant pas 5E5 cm?-2¿,? ¿et un rapport de déviation standard de densité de dislocation inférieur à 25 %. Un tel matériau peut se former sur un substrat, au moyen d'un procédé comprenant: (i) une première phase de formation du matériau en nitrure III-V sur le substrat, dans des conditions de formation de creux, par exemple par la formation de creux sur au moins 50 % de la surface de formation du matériau en nitrure III-V, la densité de creux de la surface de formation étant d'au moins 10?2¿ creux/cm?2¿ de la surface de formation, et (ii) une seconde phase de formation du matériau en nitrure III-V, dans des conditions de remplissage de creux.

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