Lead-free and cadmium-free conductive copper thick film pastes

Details Lead-free and cadmium-free conductive copper thick film pastes Lead-free and cadmium-free conductive copper thick film pastes

C - Chemistry, Metallurgy

03

C

C03C 8/22 (2006.01) C03C 8/18 (2006.01) H01B 1/02 (2006.01)

Patent

CA 2566279

Thick film conductive copper pastes that are lead-free and cadmium-free. The inventive copper pastes possess desirable characteristics, including good solderability, good wire bondability, a low firing temperature, and a wide temperature processing window, and provide excellent adhesion to a variety of substrates, including alumina and glass coated stainless steel substrates, as well as low resistivity, and a microstructure after firing that is dense and substantially free of pores.

La présente invention a trait à des pâtes conductrices en couches épaisses à base de cuivre exemptes de plomb et de cadmium. Les pâtes à base de cuivre de l'invention possèdent des caractéristiques souhaitables, y compris une bonne aptitude à la soudure, un bonne capacité de mise à la masse, un faible température de cuisson, et une large plage de températures de traitement, et assurent une excellente adhérence à une variété de substrats, comprenant des substrats en acier inoxydable revêtus d'alumine et de verre, ainsi qu'une faible résistivité, et une microstructure après cuisson qui est dense et sensiblement exempte de pores.

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