Lead type chip capacitor and process for producing the same

Details Lead type chip capacitor and process for producing the same Lead type chip capacitor and process for producing the same

H - Electricity

01

G

334/22.1, 334/7.

H01G 4/12 (2006.01) H01G 13/00 (2006.01)

Patent

CA 1317353

ABSTRACT OF THE DISCLOSURE A lead type chip capacitor which is disclosed herein comprises a capacitor chip having a lead terminal bonded thereto through a joining or bonding layer made of a highly melting metal paste. The lead type chip capacitor is produced by bonding at least one internal electrode in a capacitor chip with a lead terminal by a metal paste, drying them at a temperature in a range of 100 to 200°C, and firing the resulting capacitor chip with the lead terminal bonded thereto at a temperature in a range of 500 to 900°C in the air or in a nitrogen atmosphere.

606575

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