Low dielectric inorganic composition for multilayer ceramic...

C - Chemistry – Metallurgy – 03 – C

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C03C 3/091 (2006.01) C03C 4/16 (2006.01) C03C 8/22 (2006.01) H01L 21/48 (2006.01) H01L 23/15 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2048558

Abstract of the Disclosure A ceramic composition for forming a ceramic dielectric body having a dielectric constant of less than about 4.2. The composition is formed from a mixture of finely divided particles of 25-50 vol.% borosilicate glass and 50-75 vol.% high silica glass. The borosilicate glass comprises approximately 20-35 wt.% B2O3 and approximately 60-80 wt.% SiO2. The high silica glass contains essentially 0.5-1 wt.% alumina, 1-5 wt.% B2O3 and approximately 95-98 wt.% SiO2. The composition can be fired at a temperature of less than 1000°C.

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