Low stress die attachment

Details Low stress die attachment Low stress die attachment

H - Electricity

05

K

H05K 5/00 (2006.01) G01D 11/24 (2006.01) G02B 7/00 (2006.01)

Patent

CA 2367983

A system for resiliently attaching a mass to a package. The system includes a mass, a housing, resilient couplings for resiliently attaching the mass to the housing, bumpers for slidingly supporting the mass, and electrical connections for electrically coupling the mass to the housing.

L'invention concerne un procédé de fixation de façon élastique d'une masse à un boîtier, le système comprenant une masse (104), un boîtier (102) et des raccords (108) élastiques permettant de fixer de façon élastique la masse au boîtier.

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