4. G - Physics
  5. 01
  6. P

Howard D. Goldberg

G - Physics – 01 – P

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Country: United States Of America

Accelerometer with re-entrant grooves

G - Physics – 01 – P
Patent

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Integrated sensor packaging and multi-axis sensor assembly...

G - Physics – 01 – D
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Low stress die attachment

H - Electricity – 05 – K
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Merged-mask micro-machining process

C - Chemistry – Metallurgy – 23 – F
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Merged-mask micro-machining process

B - Operations – Transporting – 81 – C
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Profile ID: LFCA-PAI-P-1549707

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