Merged-mask micro-machining process

Details Merged-mask micro-machining process Merged-mask micro-machining process

B - Operations, Transporting

81

C

B81C 1/00 (2006.01) B81B 5/00 (2006.01) G02B 26/10 (2006.01) G06K 9/18 (2006.01)

Patent

CA 2714788

The present invention provides merged-mask processes for fabricating micro-machined devices in general and mirrored assemblies for use in optical scanning devices in particular. The process includes (a) providing a substrate having a predetermined thickness; (b) applying a first masking layer on a first portion of the substrate and a second masking layer on a second portion of the substrate, said second masking layer being at least as thick as the first masking layer; (c) etching a portion of the second masking layer to provide a first exposed portion of the substrate; (d) etching the first exposed portion of the substrate to a first depth; (e) etching the second masking layer to provide a second exposed portion of the substrate; and (f) etching simultaneously the first exposed portion of the substrate to a second depth and the second exposed portion of the substrate to a first depth. The process further comprises patterning the first masking layer before applying the second masking layer to provide the second portion of the substrate for etching and etching the first masking layer to expose the second portion of the substrate. The first and second masking layers are applied prior to etching the substrate.

Affiliated with

Also associated with

Rating

Merged-mask micro-machining process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Merged-mask micro-machining process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Merged-mask micro-machining process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1682715